Posted on: September 12, 2020 Posted by: admin Comments: 0

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IPC-7801 provides process control for solder reflow ovens by baseline and periodic verifications of oven profiles using a standard methodology to demonstrate acceptable oven performance repeatability. Equipment calibration and maintenance guidelines are provided. This standard is intended to verify the operating parameters of the reflow oven. This standard is not intended for the assembly product profile/recipe. This standard does not provide guidance for vapor phase processes.

Product Details

Published:
03/01/2015
Number of Pages:
28
File Size:
1 file , 1.6 MB